KUT SEGBOND 2550

Description

KUT SEGBOND 2550 is a specially formulated non–shrink, non-sag, solvent-free epoxy resin-based Adhesive blended with fine inert fillers. It is supplied as a two-component material in pre-weighed quantities ready for onsite mixing and use. KUT SEGBOND 2550 has been specially formulated where the Ambient temperature is varying from 25ºC to 50ºC. A fast-setting grade KUT SEGBOND 0525 for Ambient temperature at the site from 5ºC to 25ºC is also available.

Uses

KUT SEGBOND 2550 is primarily intended as an adhesive for segmental bonding of match cast and precast concrete segments, and precast concrete bridge segments to provide structural and waterproof joints. suitable as a gap-filling paste and for grouting of starter bars, holding down bolts, etc. where thixotropic consistency is required.