Description KUT SEGBOND 2550 is a specially formulated non–shrink, non-sag, solvent-free epoxy resin-based Adhesive blended with fine inert fillers. It is supplied as a two-component material in pre-weighed quantities ready for onsite mixing and use. KUT SEGBOND 2550 has been specially formulated where the Ambient temperature is varying from 25ºC to 50ºC. A fast-setting grade KUT SEGBOND 0525 for Ambient temperature at the site from 5ºC to 25ºC is also available. Uses KUT SEGBOND…
